类型 | 描述 |
---|---|
系列: | SmartFusion®2 |
包裹: | Tray |
零件状态: | Active |
建筑学: | MCU, FPGA |
核心处理器: | ARM® Cortex®-M3 |
闪存大小: | 256KB |
内存大小: | 64KB |
外围设备: | DDR, PCIe, SERDES |
连通性: | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
速度: | 166MHz |
主要属性: | FPGA - 60K Logic Modules |
工作温度: | 0°C ~ 85°C (TJ) |
包/箱: | 676-BGA |
供应商设备包: | 676-FBGA (27x27) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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