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MEMS OSC XO 3.5700MHZ H/LV-CMOS
CONN RCPT 31POS 0.1 GOLD PCB R/A
TVS DIODE
THERM PAD 228.6MMX228.6MM GREEN
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| 类型 | 描述 |
|---|---|
| 系列: | Tflex™ 300 |
| 包裹: | Bulk |
| 零件状态: | Active |
| 用法: | - |
| 类型: | Gap Filler Pad, Sheet |
| 形状: | Square |
| 大纲: | 228.60mm x 228.60mm |
| 厚度: | 0.180" (4.57mm) |
| 材料: | Silicone Elastomer |
| 粘合剂: | - |
| 后盾，载体: | - |
| 颜色: | Green |
| 热电阻率: | 2.11°C/W |
| 导热系数: | 1.2W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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