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RES 590K OHM 0.1% 1/8W 0805
RES 66.5K OHM 1/8W 1% AXIAL
HEATSINK FOR 45MM BGA
CONN PLUG FMALE 27P GOLD SLD CUP
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| 类型 | 描述 |
|---|---|
| 系列: | 628 |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
| 附着方式: | Thermal Tape, Adhesive (Included) |
| 形状: | Square, Pin Fins |
| 长度: | 1.750" (44.45mm) |
| 宽度: | 1.700" (43.18mm) |
| 直径: | - |
| 翅片高度: | 0.350" (8.89mm) |
| 功耗@温升: | 3.0W @ 50°C |
| 热阻@强制气流: | 10.00°C/W @ 150 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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628-35ABT4EWakefield-Vette |
HEATSINK FOR 45MM BGA |
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ATS-21C-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
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ATS-21E-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
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ATS-03F-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
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530001B02100GAavid |
BOARD LEVEL HEAT SINK |
|
|
ATS-18F-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
624-60ABT3Wakefield-Vette |
HEATSINK FOR 21MM BGA |
|
|
ATS-03F-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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|
ATS-14D-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
625-35ABT5Wakefield-Vette |
HEATSINK FOR 25MM BGA |
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592502B02800GAavid |
BOARD LEVEL HEAT SINK |
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|
ATS-07E-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
ATS-20C-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |