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COOLX POWER SUPPLY
TFLEX HD360 GAP FILLER 18X18"
CONN RCPT 8POS 0.05 GOLD SMD
.050 X .050 C.L. FEMALE IDC ASSE
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| 类型 | 描述 |
|---|---|
| 系列: | CLP |
| 包裹: | Bag |
| 零件状态: | Active |
| 连接器类型: | Receptacle, Bottom Entry |
| 联系方式: | Female Socket |
| 风格: | Board to Board |
| 职位数: | 8 |
| 加载的位置数: | All |
| 俯仰交配: | 0.050" (1.27mm) |
| 行数: | 2 |
| 行距 - 交配: | 0.050" (1.27mm) |
| 安装类型: | Surface Mount |
| 终止: | Solder |
| 紧固类型: | Push-Pull |
| 接触完成 - 交配: | Gold |
| 接触表面厚度 - 配合: | 30.0µin (0.76µm) |
| 绝缘颜色: | Black |
| 绝缘高度: | 0.084" (2.14mm) |
| 接触长度 - 后: | - |
| 工作温度: | -55°C ~ 125°C |
| 材料可燃性等级: | UL94 V-0 |
| 接触完成 - 发布: | Tin |
| 配对堆叠高度: | - |
| 入口保护: | - |
| 特征: | - |
| 额定电流（安培）: | 3.3A per Contact |
| 额定电压: | 240VAC, 330VDC |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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