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TI400 IR CM W/DMM A3001 FC IFLEX
CONN 20POS SOLDER 24-32AWG GOLD
INSULATION DISPLACEMENT TERMINAL
IC DRAM 16GBIT 1600MHZ FBGA
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| 类型 | 描述 |
|---|---|
| 系列: | MTB |
| 包裹: | Bulk |
| 零件状态: | Active |
| 连接器类型: | - |
| 联系方式: | Male Pin |
| 职位数: | 20 |
| 沥青: | 0.050" (1.27mm) |
| 行数: | 1 |
| 行间距: | - |
| 安装类型: | Free Hanging (In-Line) |
| 紧固类型: | Push-Pull |
| 电缆终端: | Solder |
| 线型: | Discrete |
| 线规: | 24-32 AWG |
| 特征: | - |
| 接触完成: | Gold |
| 接触面厚度: | 50.0µin (1.27µm) |
| 颜色: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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