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HEXFET POWER MOSFET
CONN FPC BOTTOM 18POS 1.00MM R/A
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| 类型 | 描述 |
|---|---|
| 系列: | WR-FPC |
| 包裹: | Tape & Reel (TR)Cut Tape (CT) |
| 零件状态: | Active |
| 扁平弯曲型: | FPC |
| 安装类型: | Surface Mount, Right Angle |
| 连接器/触点类型: | Contacts, Bottom |
| 职位数: | 18 |
| 沥青: | 0.039" (1.00mm) |
| 终止: | Solder |
| ffc, fcb 厚度: | 0.29mm ~ 0.34mm |
| 离板高度: | 0.118" (3.00mm) |
| 锁定功能: | Slide Lock |
| 电缆端型: | Tapered |
| 接触材料: | Phosphor Bronze |
| 接触完成: | Tin |
| 筑屋材料: | Polyphenylene Sulfide (PPS) |
| 执行器材料: | Polyphenylene Sulfide (PPS) |
| 特征: | Solder Retention, Zero Insertion Force (ZIF) |
| 额定电压: | 125V |
| 工作温度: | -25°C ~ 85°C |
| 材料可燃性等级: | UL94 V-0 |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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