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MEMS OSC XO 66.6000MHZ H/LV-CMOS
CONN SOCKET 50POS 0.1 GOLD PCB
CONN HEADER DUAL BEAM 100POS PCB
CONN EDGE DUAL FMALE 40POS 0.031
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| 类型 | 描述 |
|---|---|
| 系列: | Z-PACK HS3 |
| 包裹: | Tube |
| 零件状态: | Active |
| 连接器使用: | Backplane |
| 连接器类型: | Header, Male Pins and Blades |
| 连接器样式: | Dual Beam, Center |
| 职位数: | 100 |
| 加载的位置数: | All |
| 沥青: | 0.098" (2.50mm) |
| 行数: | 10 |
| 列数: | 10 |
| 安装类型: | Through Hole |
| 终止: | Press-Fit |
| 触点布局，典型: | - |
| 特征: | - |
| 接触完成: | Gold |
| 接触面厚度: | 30.0µin (0.76µm) |
| 颜色: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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