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RES SMD 22.6K OHM 1% 1/10W 0402
CBL CLIP BUNDLING BLACK FIR TREE
IC MCU 32BIT 4KB FLASH 33QFN
RES 2.74K OHM 0.25% 1/8W 1206
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| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Bag |
| 零件状态: | Active |
| 类型: | Clip, Bundling |
| 类型属性: | - |
| 开口尺寸: | - |
| 安装类型: | Fir Tree |
| 材料: | Polyamide (PA66), Nylon 6/6 |
| 颜色: | Black |
| 长度: | 1.575" (40.00mm) |
| 宽度: | 0.315" (8.00mm) |
| 高度: | 0.059" (1.50mm) |
| 面板孔尺寸: | 0.248" x 0.354" (6.30mm x 9.00mm), Oval |
| 材料厚度: | - |
| 材料可燃性等级: | - |
| 粘合剂: | - |
| 特征: | Heat Stabilized, Impact Resistant, UV Resistant |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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