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IGBT MODULE
BREADBRD PREPUNCHED INSULAT NPTH
IC FIFO 8KX18 LP 15NS 64QFP
ESX0004 REV(NONE) 70507463
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| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Bulk |
| 零件状态: | Obsolete |
| 原型板类型: | Breadboard, Prepunched Insulating |
| 电镀: | Non-Plated Through Hole (NPTH) |
| 沥青: | 0.100" (2.54mm) |
| 电路图: | - |
| 边缘接触: | - |
| 孔径: | 0.038" (0.97mm) |
| 尺寸/尺寸: | 4.42" L x 1.68" W (112.3mm x 42.7mm) |
| 板厚: | 0.062" (1.58mm) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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