THERM PAD 180MMX115MM W/ADH GRAY
IC OPAMP GP 4 CIRCUIT 14SOIC
IC FPGA 130 I/O 208QFP
HEATSHRINK 3/4" BLACK
类型 | 描述 |
---|---|
系列: | SX-A |
包裹: | Tray |
零件状态: | Obsolete |
实验室/俱乐部数量: | 768 |
逻辑元件/单元的数量: | - |
总内存位: | - |
输入/输出数: | 130 |
门数: | 12000 |
电压 - 电源: | 2.25V ~ 5.25V |
安装类型: | Surface Mount |
工作温度: | -40°C ~ 125°C (TA) |
包/箱: | 208-BFQFP |
供应商设备包: | 208-PQFP (28x28) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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