







RELAY TELECOM DPDT 2A 4.5VDC
SFERNICE THIN FILMS
BOARD LEVEL HEAT SINK
DC DC CONVERTER 24V 75W
| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Board Level |
| 包冷却: | TO-220 |
| 附着方式: | Bolt On |
| 形状: | Rectangular, Fins |
| 长度: | 0.750" (19.05mm) |
| 宽度: | 0.520" (13.21mm) |
| 直径: | - |
| 翅片高度: | 0.330" (8.38mm) |
| 功耗@温升: | 1.0W @ 30°C |
| 热阻@强制气流: | 7.00°C/W @ 300 LFM |
| 热阻@自然: | 22.50°C/W |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
|
|
904-27-1-21-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 27X27MM CLIP |
|
|
ATS-07D-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-20A-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
625-25ABWakefield-Vette |
HEATSINK FOR 25MM BGA |
|
|
HSET838-BGA-1iBASE Technology |
HEAT SPREADER FOR ET839 (H051HSE |
|
|
ATS-09H-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-19C-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
662-15AGWakefield-Vette |
HEATSINK EXTRUSION 45MM |
|
|
ATS-06F-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
531102B02100GAavid |
BOARD LEVEL HEAT SINK |
|
|
642-60ABT1EWakefield-Vette |
HEATSINK FOR 35MM BGA |
|
|
ATS-02C-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
ATS-14H-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |