English
简体中文
CAP CER 15PF 250V C0G/NP0 0805
CAP CER SMP MLC HI-REL
BOARD LEVEL HEAT SINK
CAP CER
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Board Level |
| 包冷却: | TO-3 |
| 附着方式: | Bolt On |
| 形状: | Rhombus |
| 长度: | 1.830" (46.48mm) |
| 宽度: | 1.830" (46.48mm) |
| 直径: | - |
| 翅片高度: | 1.000" (25.40mm) |
| 功耗@温升: | 4.0W @ 30°C |
| 热阻@强制气流: | 3.50°C/W @ 200 LFM |
| 热阻@自然: | 6.00°C/W |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
|
ATS-07F-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
630-35ABT3Wakefield-Vette |
HEATSINK FOR 35MM BGA |
|
|
ATS-21F-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
ATS-18H-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
TGH-0500-01t-Global Technology |
ALUMINIUM HEAT SINK 50X50MM |
|
|
624-35ABT3Wakefield-Vette |
HEATSINK FOR 21MM BGA |
|
|
ATS-07H-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-55325R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 32.5X32.5X19.5MM NO TIM |
|
|
ATS-55300K-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 30X30X14.5MM W/OUT TIM |
|
|
ATS-20G-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
ATS-55170R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 17X17X19.5MM W/OUT TIM |
|
|
40139Vicor |
BOM, ASSEMBLY, 3623 XF PUSH PI |
|
|
ATS-54150K-C3-R0Advanced Thermal Solutions, Inc. |
HEATSINK 15X15X14.5MM W/3M8815 |