







MEMS OSC XO 66.6666MHZ H/LV-CMOS
HEATSINK 31X31X9.5MM W/OUT TIM
CONN RCPT HSG FMALE 39POS PNL MT
CONN RCPT USB2.0 TYPEA STACK R/A
| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | BGA |
| 附着方式: | Thermal Tape, Adhesive (Not Included) |
| 形状: | Square, Pin Fins |
| 长度: | 1.220" (30.99mm) |
| 宽度: | 1.220" (30.99mm) |
| 直径: | - |
| 翅片高度: | 0.374" (9.50mm) |
| 功耗@温升: | - |
| 热阻@强制气流: | 13.50°C/W @ 200 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
|
|
ATS-14F-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
ATS-19E-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
ATS-05A-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
7140DGAavid |
BOARD LEVEL HEAT SINK |
|
|
302NNWakefield-Vette |
HEATSINK COMPACT |
|
|
624-35ABT5Wakefield-Vette |
HEATSINK FOR 21MM BGA |
|
|
ATS-13C-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-55400K-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X14.5MM W/OUT TIM |
|
|
ATS-20C-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
ATS-17H-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-06G-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-15E-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
6380BGAavid |
BOARD LEVEL HEAT SINK |