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RES 590K OHM 0.1% 1/8W 0805
THERMAL PAD, SHEET 160X160MM, TH
HEATSINK 40X40X9.5MM XCUT
B33, B345 DS, WHITE, 0.439 X 2"
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | pushPIN™ |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
| 附着方式: | Push Pin |
| 形状: | Square, Fins |
| 长度: | 1.575" (40.00mm) |
| 宽度: | 1.575" (40.00mm) |
| 直径: | - |
| 翅片高度: | 0.374" (9.50mm) |
| 功耗@温升: | - |
| 热阻@强制气流: | 27.64°C/W @ 100 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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