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RES SMD 560 OHM 2% 1/4W 1206
THERM PAD 150MMX150MM RED
HEATSINK 36.83X57.6X11.43MM T412
OM3 12F INTERCONN OFNP MPO F TY
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| 类型 | 描述 |
|---|---|
| 系列: | pushPIN™ |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
| 附着方式: | Push Pin |
| 形状: | Rectangular, Fins |
| 长度: | 1.450" (36.83mm) |
| 宽度: | 2.267" (57.60mm) |
| 直径: | - |
| 翅片高度: | 0.450" (11.43mm) |
| 功耗@温升: | - |
| 热阻@强制气流: | 14.90°C/W @ 100 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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