







FIXED IND 330UH 930MA 520 MOHM
2.5X2.0 20PPM @25C 20PPM (-20 TO
MEMS OSC XO 33.3333MHZ H/LV-CMOS
CONN IC DIP SOCKET 50POS GOLD
| 类型 | 描述 |
|---|---|
| 系列: | Lo-PRO®file, 513 |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | DIP, 0.9" (22.86mm) Row Spacing |
| 位置或引脚数(网格): | 50 (2 x 25) |
| 俯仰交配: | 0.100" (2.54mm) |
| 接触完成 - 交配: | Gold |
| 接触表面厚度 - 配合: | 10.0µin (0.25µm) |
| 接触材料 - 配合: | Beryllium Copper |
| 安装类型: | Through Hole |
| 特征: | Closed Frame |
| 终止: | Solder |
| 投稿: | 0.100" (2.54mm) |
| 接触完成 - 发布: | Tin |
| 接触完成厚度 - 后: | 200.0µin (5.08µm) |
| 联系材料 - 帖子: | Brass |
| 筑屋材料: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| 工作温度: | -55°C ~ 105°C |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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