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MEMS OSC XO 25.0000MHZ H/LV-CMOS
CONN FPC BOTTOM 18POS 0.50MM R/A
IC SRAM 9MBIT PARALLEL 100TQFP
WR CONST 1-7/8 BLK
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| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Tape & Reel (TR)Cut Tape (CT) |
| 零件状态: | Active |
| 扁平弯曲型: | FPC |
| 安装类型: | Surface Mount, Right Angle |
| 连接器/触点类型: | Contacts, Bottom |
| 职位数: | 18 |
| 沥青: | 0.020" (0.50mm) |
| 终止: | Solder |
| ffc, fcb 厚度: | 0.30mm |
| 离板高度: | 0.081" (2.05mm) |
| 锁定功能: | Flip Lock |
| 电缆端型: | Straight |
| 接触材料: | Phosphor Bronze |
| 接触完成: | Gold |
| 筑屋材料: | Liquid Crystal Polymer (LCP) |
| 执行器材料: | Liquid Crystal Polymer (LCP) |
| 特征: | Solder Retention, Zero Insertion Force (ZIF) |
| 额定电压: | 250V |
| 工作温度: | -20°C ~ 85°C |
| 材料可燃性等级: | UL94 V-0 |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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