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3.2X2.5 30PPM @25C 30PPM (-20 TO
MEMS OSC XO 74.1760MHZ H/LV-CMOS
CONN RCPT FMALE 9P GOLD SLDR CUP
MOLDED PARTS
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| 类型 | 描述 |
|---|---|
| 系列: | ODU MEDI-SNAP® |
| 包裹: | Bulk |
| 零件状态: | Active |
| 连接器类型: | Receptacle, Female Sockets |
| 职位数: | 9 |
| 外壳尺寸 - 插入: | 1 |
| 外壳尺寸，密尔: | - |
| 安装类型: | Free Hanging (In-Line) |
| 安装功能: | - |
| 终止: | Solder Cup |
| 紧固类型: | Push-Pull |
| 方向: | A |
| 外壳材质: | Polysulfone (PSU) |
| 外壳饰面: | - |
| 接触完成 - 交配: | Gold |
| 颜色: | Black, Gray |
| 入口保护: | IP50 - Dust Protected |
| 材料可燃性等级: | - |
| 特征: | Backshell |
| 屏蔽: | Unshielded |
| 额定电流（安培）: | - |
| 额定电压: | - |
| 电缆开口: | 0.106" ~ 0.154" (2.70mm ~ 3.90mm) |
| 工作温度: | -50°C ~ 120°C |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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